Introduction to Materials Science

Jay Desai

Materials Scientist and Metallurgical En...

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Language

English

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December 1, 2024

8:30 AM (Local)

2 Hrs

This course format is where trainer will explain you the subject via online live session. This course will run as per specific date and time.

₹ 149

online

₹ 149

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Why do you enroll

This course is designed to understand the processing-structure-property-applications co-relationships in different materials. It offers an in-depth exploration of essential topics in materials science, covering atomic structure and bonding, material characterization methods, mechanical testing, diffusion, and phase transformations. Students will gain a solid understanding of different engineering materials and how their properties can be manipulated to obtain high quality and more reliable advanced materials needed to maximize part performance, application regime, and customer satisfaction.

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Key topics covered

Atomic Structure, Bonding in Materials, Materials Characterization, Testing of Materials, Diffusion, Phase Transformations

Course Details

This session is the first class for the course "Introduction to Materials Science". It will cover Atomic structure and Bonding in various types of engineering materials, including metals, alloys, ceramics, polymers, and composites. The basics of ionic, covalent, metallic, and Van der Waals bonding will be covered along with crystal structures in metals and ceramics.

A solid understanding of atomic structure and bonding principles is essential for predicting material properties and behaviors. This knowledge is key to designing and developing new materials with tailored properties required for synthesis and fabrication of more efficient, durable, and innovative products.

Series of two hour classes will be conducted for this course to provide an in-depth understanding of Atomic structure, Bonding in Materials, Materials characterization, Testing of Materials, Diffusion in Materials, and effect of Phase Transformations on Material performance.